National Instruments 783564-33 PXI MultiComputing Processing Module

The National Instruments 783564-33, or PXIe-8830MC, is a high performance processing module designed to enable data exchange between multiple intelligent systems using PCI Express technology. It features an Intel Core i7-4700EQ quad core processor running at 2.3 GHz with a 6 MB cache. This makes it suitable for demanding real time applications. This processor is connected to a SO-DIMM block that supports one 64-bit DDR3L SDRAM socket allowing up to 8 GB of memory and providing ample resources for complex computational tasks.

One of the key advantages of the 783564-33 module is its ability to function as a coprocessor in a PXI system. This module offloads processing tasks from the primary embedded controller and improves overall system efficiency by being installed in any PXI Express peripheral slot. It operates on the LabVIEW Real-Time OS by enabling deterministic control and high speed data processing. The Platform Controller Hub (PCH) integrates essential interfaces such as USB and PCI Express to facilitate connectivity with peripheral devices.

The NI 783564-33 module supports a wide range of interfaces including two high speed USB 2.0 ports. This makes it easy to connect additional devices for data acquisition or control. An Intel I217-LM Gigabit Ethernet controller provides high speed network connectivity and enables efficient communication between systems. The module also features a watchdog timer for system reliability which can reset the processor in case of a fault.

This processing module is designed to fit into a 2-slot 3U PXI Express chassis and it weighs approximately 0.82 kg (1.80 lbs). The module’s power consumption is optimized with typical current requirements of 1450 mA at 3.3 V, 3750 mA at 12 V and 70 mA at 5 V_Aux. This ensures efficient power usage across various workloads.

The 783564-33 module can operate within a temperature range of 0 °C to 40 °C under maximum performance and up to 55 °C under extended conditions. It can withstand operational shocks of 30 g peak and random vibrations of up to 0.3 g RMS. This durability ensures the module’s reliability under rigorous conditions extending its lifespan and maintaining performance integrity.